Other Products
SEMCTCEH specializes in the integrated development, production and sales of wet process equipment.
Fully Automatic Electroplating System
| Item | Specification |
| Applicable Workpiece | 2~12 inch wafer plating |
| Batch Capacity | pcs/batch |
| Process Flow | Pre-treatment → Plating → Rinsing (Au, Ni, Cu...) |
| Main Materials | Metal frame + PVC/PPW shell plate, tank made of PVDF/PPN material |
| Transfer Method | Manual transfer |
| Cycle Time | Adjustable from 5~10 minutes according to process requirements |
| Other Description | This equipment can be customized to manual/semi-automatic operation according to customer requirements |
